TY  - BOOK
AU  - Lau, John H.; Pao, Yi-hsin
TI  - Solder Joint Reliability of BGA, CSP, Flip chip, and Fine Pitch SMT Assemblies
SN  - 9780070366480
U1  - 621.381046 LAU 
PY  - 1997///
CY  - USA
PB  - Mcgraw Hill 
ER  -