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Solder Joint Reliability of BGA, CSP, Flip chip, and Fine Pitch SMT Assemblies

By: Material type: TextTextPublication details: 1997 USA Mcgraw Hill Description: 408 p 22 cmISBN:
  • 9780070366480
DDC classification:
  • 621.381046 LAU
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Holdings
Item type Current library Collection Call number Status Barcode
Book Book Air University's Aerospace and Aviation Campus Kamra Electrical Engineering 621.381046 LAU (Browse shelf(Opens below)) Available AUKP3027
Browsing Air University's Aerospace and Aviation Campus Kamra shelves, Shelving location: Electrical Engineering , Collection: Electrical Engineering Close shelf browser (Hides shelf browser)
621.381044 VAR Power Electronics 621.381044 VAR Power Electronics 621.381044 VAR Power Electronics 621.381046 LAU Solder Joint Reliability of BGA, CSP, Flip chip, and Fine Pitch SMT Assemblies 621.381078 DOS Basic Electronics For Tomorrow's Inventors 621.3811 SCH Communication Systems and Techniques 621.3813 HUE Basic Circuit Theory

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