Solder Joint Reliability of BGA, CSP, Flip chip, and Fine Pitch SMT Assemblies

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Material type: Text

TextPublication details: 1997 USA Mcgraw Hill Description: 408 p 22 cmISBN:

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Holdings
Item type	Current library	Collection	Call number	Status	Barcode
Book	Air University's Aerospace and Aviation Campus Kamra	Electrical Engineering	621.381046 LAU (Browse shelf(Opens below))	Available	AUKP3027

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